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1

Improvement of TDDB reliability, characteristics of HfO2 high-k/metal gate MOSFET device with oxygen post deposition annealing

Chia-Wei Hsu, Yean-Kuen Fang, Wen-Kuan Yeh, Chun-Yu Chen, Yen-Ting Chiang, Feng-Renn Juang, Chien-Ting Lin, Chien-Ming Lai

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 426 KB

english, 2010

2

Study on device reliability for P-type FinFETs with different fin numbers

Yang, Yi-Lin, Zhang, Wenqi, Yan, Shen-Yi, Yu, Yin-Hung, Fang, Zhen-Yu, Yeh, Wen-Kuan

Journal:

Year:

2020

File:

PDF, 4.19 MB

2020

3

[IEEE 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu, Taiwan (2020.8.10-2020.8.13)] 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Stacked Ge Nanosheet GAAFETs Fabrication and Strain Effects Measurement

Chu, Chun-Lin, Luo, Guang-Li, Wu, Kehuey, Chen, Shih-Hong, Chen, Bo-Yuan, Wu, Wen-Fa, Yeh, Wen-Kuan

Year:

2020

File:

PDF, 704 KB

2020

4

[IEEE 2016 IEEE Silicon Nanoelectronics Workshop (SNW) - Honolulu, HI, USA (2016.6.12-2016.6.13)] 2016 IEEE Silicon Nanoelectronics Workshop (SNW) - Suspended Ge gate-all-around nanowire nFETs with junction isolation on bulk Si

Wan, Chia-Chen, Luo, Guang-Li, Hsu, Shu-Han, Hung, Kuo-Dong, Chu, Chun-Lin, Hou, Tuo-Hung, Su, Chun-Jun, Chen, Szu-Hung, Wu, Wen-Fa, Yeh, Wen-Kuan

Year:

2016

Language:

english

File:

PDF, 949 KB

english, 2016

5

AlN Surface Passivation of GaN-Based High Electron Mobility Transistors by Plasma-Enhanced Atomic Layer Deposition

Tzou, An-Jye, Chu, Kuo-Hsiung, Lin, I-Feng, Østreng, Erik, Fang, Yung-Sheng, Wu, Xiao-Peng, Wu, Bo-Wei, Shen, Chang-Hong, Shieh, Jia-Ming, Yeh, Wen-Kuan, Chang, Chun-Yen, Kuo, Hao-Chung

Journal:

Nanoscale Research Letters

Year:

2017

Language:

english

File:

PDF, 1.61 MB

english, 2017

6

The Observation of Width Quantization impact on Device Performance and Reliability for high-k/metal Tri-Gate FinFET

Yeh, Wen-Kuan, Zhang, Wenqi, Yang, Yi-Lin, Dai, An-Ni, Wu, Kehuey, Chou, Tung-Huan, Lin, Cheng-Li, Gan, Kwang-Jow, Shih, chia-hung, Chen, Po-Ying

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2016

Language:

english

File:

PDF, 755 KB

english, 2016

7

Study on Intrinsic Hot Carrier Degradation of FinFETs with Different Stress Conditions and Fin Numbers by Decoupling PBTI Component

Yang, Yi-Lin, Zhang, Wenqi, Yeh, Wen-Kuan

Journal:

ECS Journal of Solid State Science and Technology

Year:

2020

Language:

english

File:

PDF, 1.73 MB

english, 2020

8

[IEEE 2016 International Conference on Microelectronic Test Structures (ICMTS) - Yokohama, Japan (2016.3.28-2016.3.31)] 2016 International Conference on Microelectronic Test Structures (ICMTS) - Ultra-small and ultra-reliable innovative fuses scalable from 0.35um to 28nm

Chung, Shine, Fang, Wen-Kuan, Hsu, YC, Hsiao, JY, Lin, Lupin, Yu, Wen-Hua

Year:

2016

Language:

english

File:

PDF, 12.54 MB

english, 2016

9

Postdiagnostic Metformin Use and Survival of Patients With Colorectal Cancer: A Nationwide Cohort study

Huang, Wen-Kuan, Chang, Shu-Hao, Hsu, Hung-Chih, Chou, Wen-Chi, Yang, Tsai-Sheng, Chen, Jen-Shi, Chang, John Wen-Cheng, Lin, Yung-Chang, Kuo, Chang-Fu, See, Lai-Chu

Journal:

International Journal of Cancer

Year:

2020

Language:

english

File:

PDF, 5.27 MB

english, 2020

10

[IEEE 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 - Taiwan (5-8 July 2004)] Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) - Efficient improvement of hot-carrier-induced degradation for sub-0.1 μm CMOSFET

Chieh-Ming Lai,, Yean-Kuen Fang,, Wen-Kuan Yeh,, Chia-Che Hu,, Jung-Chun Lin,, Shing-Tai Pan,

Year:

2004

File:

PDF, 7 KB

2004

11

[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA, USA (2017.10.16-2017.10.19)] 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - 32Kb Innovative fuse (I-Fuse) array in 22nm FD-SOI with 0.9V/1.4mA program voltage/current and 0.744um 2 cell

Chung, Shine, Fang, Wen-Kuan, Lin, Jay, Yu, Wen-Hua, Hsiao, J Y

Year:

2017

Language:

english

File:

PDF, 1.29 MB

english, 2017

12

Oncological Safety and Outcomes of Nipple-Sparing Mastectomy With Breast Reconstruction

Ou, Kuang-Wen, Yu, Jyh-Cherng, Ho, Meng-Hsing, Chiu, Wen-Kuan, Ou, Kuang-Lin, Chen, Tim-Mo, Chen, Shyi-Gen

Journal:

Annals of Plastic Surgery

Year:

2015

Language:

english

File:

PDF, 925 KB

english, 2015

13

The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs

Chieh-Ming Lai, Yean-Kuen Fang, Chien-Ting Lin, Chia-Wei Hsu, Wen-Kuan Yeh

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 533 KB

english, 2007

14

The Impact of Strain Technology on FUSI Gate SOI CMOSFET

Wen-Kuan Yeh,, Jean-An Wang,, Ming-Hsing Tsai,, Chien-Ting Lin,, Po-Ying Chen,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 393 KB

english, 2009

15

[IEEE 2008 IEEE International Reliability Physics Symposium (IRPS) - Phoenix, AZ, USA (2008.04.27-2008.05.1)] 2008 IEEE International Reliability Physics Symposium - Effect of crystal-originated particles (COPs) on ULSI process integrity

Po-Ying Chen,, Chen, S. L., Tsai, M. H., Jing, M. H., Lin, T.-C., Wen-Kuan Yeh,

Year:

2008

Language:

english

File:

PDF, 1.32 MB

english, 2008

16

Thermal stability of AlSiCu/Wn+p diodes with and without TiN barrier layer

Wen-Kuan Yeh, Mao-Chieh Chen, Pei-Jan Wang, Lu-Min Liu, Mou-Shiung Lin

Journal:

Thin Solid Films

Year:

1995

Language:

english

File:

PDF, 628 KB

english, 1995

17

Significantly improving sub-90 nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer

Chia-Wei Hsu, Yean-Kuen Fang, Wen-Kuan Yeh, Chien-Ting Lin

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 589 KB

english, 2008

18

The Geometry Effect of Contact Etch Stop Layer Impact on Device Performance and Reliability for 90-nm SOI nMOSFETs

Chieh-Ming Lai, Yean-Kuen Fang, Chien-Ting Lin, Wen-Kuan Yeh

Journal:

IEEE Transactions on Electron Devices

Year:

2006

Language:

english

File:

PDF, 457 KB

english, 2006

19

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Junction induced variation and reliability for ultra-thin-body and bulk oxide MOSFETs

Yeh, Wen-Kuan, Chang, Wen-Teng, Chen, Po-Ying, Lin, Cheng-Li

Year:

2014

Language:

english

File:

PDF, 238 KB

english, 2014

20

Epitope imprinting of alpha-synuclein for sensing in Parkinson's brain organoid culture medium

Lee, Mei-Hwa, Thomas, James L., Su, Zi-Lin, Yeh, Wen-Kuan, Monzel, Anna S., Bolognin, Silvia, Schwamborn, Jens C., Yang, Chien-Hsin, Lin, Hung-Yin

Journal:

Biosensors and Bioelectronics

Year:

2020

File:

PDF, 3.16 MB

2020

21

Stacked Ge-Nanosheet GAAFETs Fabricated by Ge/Si Multilayer Epitaxy

Chu, Chun-Lin, Wu, Kehuey, Luo, Guang-Li, Chen, Bo-Yuan, Chen, Shih-Hong, Wu, Wen-Fa, Yeh, Wen-Kuan

Journal:

IEEE Electron Device Letters

Year:

2018

Language:

english

File:

PDF, 580 KB

english, 2018

22

[IEEE 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA, USA (2018.10.15-2018.10.18)] 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - A 0.0487mm2 4Kx8 Metal-Gate Innovative Fuse Memory at 22nm FD-SOI with 1.2V+/-16% Program Voltage, 0.42V Vddmin, and Full Testability

Chung, Shine, Lin, Jay, Fang, Wen-Kuan, Yu, Wen-Hua, Wendt, Michael, Prengel, Helmut, Xu, Anmin, Lee, Heng Kah.

Year:

2018

Language:

english

File:

PDF, 533 KB

english, 2018

23

Study on interfacial trap location induced subthreshold slope degradation extracted by random telegraph noise for high-k/metal gate FinFET devices

Yang, Yi-Lin, Zhang, Wenqi, Chen, Yu-Lin, Yeh, Wen-Kuan

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 1.39 MB

2020

24

Selective tungsten CVD on submicron contact hole

Wen-Kuan Yeh, Mao-Chieh Chen, Pei-Jan Wang, Lu-Min Liu, Mou-Shiung Lin

Journal:

Thin Solid Films

Year:

1995

Language:

english

File:

PDF, 597 KB

english, 1995

25

[IEEE Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 - Taiwan (5-8 July 2004)] Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) - Efficient improvement of hot-carrier-induced degradation for sub-0.1 μm CMOSFET

Chieh-Ming Lai,, Yean-Kuen Fang,, Wen-Kuan Yeh,, Chia-Che Hu,, Jung-Chun Lin,, Shing-Tai Pan,

Year:

2004

Language:

english

File:

PDF, 213 KB

english, 2004

26

[IEEE 2013 IEEE 8th Nanotechnology Materials and Devices Conference (NMDC) - Tainan, Taiwan (2013.10.6-2013.10.9)] 2013 IEEE 8th Nanotechnology Materials and Devices Conference (NMDC) - Comprehensive device reliability and oxide traps distribution analysis by the low frequency noise in ultra-thin body SOI (UTBSOI) MOSFETs

Lin, Cheng-Li, Soh, Chun-Hung, Yeh, Wen-Kuan, Lin, Chien-Ting, Wu, Chun-Ming, Yang, Yao-Hsiang, Chang, Wei-Yi, Huang, Yen-Lun

Year:

2013

Language:

english

File:

PDF, 1.45 MB

english, 2013

27

Regulated internalization of NMDA receptors drives PKD1-mediated suppression of the activity of residual cell-surface NMDA receptors

Fang, Xiao-Qian, Qiao, Haifa, Groveman, Bradley R., Feng, Shuang, Pflueger, Melissa, Xin, Wen-Kuan, Ali, Mohammad K., Lin, Shuang-Xiu, Xu, Jindong, Duclot, Florian, Kabbaj, Mohamed, Wang, Wei, Ding, X

Journal:

Molecular Brain

Year:

2015

Language:

english

File:

PDF, 1.85 MB

english, 2015

28

Spontaneous Pneumothorax in Flight as First Manifestation of Alpha-1 Antitrypsin Deficiency

Lin, Yi-Chang, Chiu, Wen-Kuan, Chang, Hung, Cheng, Yeung-Leung, Chen, Jen-Chin

Journal:

Aviation Space and Environmental Medicine

Year:

2008

Language:

english

File:

PDF, 808 KB

english, 2008

29

Small-size printed antenna integrated with coupled-fed meandered strip

Chen, Lih-Shan, Lin, Wen-Kuan, Shih, Huai-Ren

Journal:

Microwave and Optical Technology Letters

Year:

2017

Language:

english

File:

PDF, 392 KB

english, 2017

30

Back-biasing to Performance and Reliability Evaluation of UTBB FDSOI, Bulk FinFETs, and SOI FinFETs

Chang, Wen-Teng, Shih, Cheng-Ting, Wu, Jhao-Lin, Lin, Shih-Wei, Yeh, Wen-Kuan

Journal:

IEEE Transactions on Nanotechnology

Year:

2017

Language:

english

File:

PDF, 761 KB

english, 2017

31

The impact of gate oxide scaling (3.2–1.2 nm) on sub-100 nm complementary metal-oxide-semiconductor field-effect transistors

Wen-kuan Yeh, Chih-yung Lin

Journal:

Thin Solid Films

Year:

2002

Language:

english

File:

PDF, 1.01 MB

english, 2002

32

External Stresses on Tensile and Compressive Contact Etching Stop Layer SOI MOSFETs

Wen-Teng Chang, Chih-Chung Wang, Jian-An Lin, Wen-Kuan Yeh

Journal:

IEEE Transactions on Electron Devices

Year:

2010

Language:

english

File:

PDF, 301 KB

english, 2010

33

A Low Thermal Budget High Performance 0.25–0.18 µm Merged Logic Device and Dynamic Random Access Memory Application

Yeh, Wen-Kuan, Lin, Yung-Chang, Chen, Tung-Po, Huang, Cheng-Tung, Chang, Sun-Jay, Lin, Wen-Jeng, Jung, Le-Tien, Chien, Sun-Chieh, Sun, Shin-Wei, Liou, Fou-Tai

Journal:

Japanese Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 703 KB

english, 2000

34

[IEEE 2019 IEEE Photonics Conference (IPC) - San Antonio, TX, USA (2019.9.29-2019.10.3)] 2019 IEEE Photonics Conference (IPC) - Improvement of Quantum-Well Intermixing through Adjusting P-Doped Layer for High-Performance SOA-Integrated EAM

Chen, Yang-Jeng, Fang, Yi-Hsin, Hsu, Wen-kuan, Chen, Rih-You, Chen, Cong-Long, Chiu, Yi-Jen, Lin, W.

Year:

2019

Language:

english

File:

PDF, 301 KB

english, 2019

35

[IEEE 2020 5th International Conference on Devices, Circuits and Systems (ICDCS) - Coimbatore, India (2020.3.5-2020.3.6)] 2020 5th International Conference on Devices, Circuits and Systems (ICDCS) - Investigation of AlGaN/GaN HEMT Breakdown analysis with Source field plate length for High power applications

D, Godfrey, Nirmal, D, L, Arivazhagan, Roy, Brigis, Chen, Yu-Lin, Yu, Tien-Han, Roy, Brigis, Yeh, Wen-Kuan, D, Godwinraj

Year:

2020

File:

PDF, 3.27 MB

2020

36

A New Form of Artificial Skin to Promote Permanent Wound Coverage

Wang, Hsian-Jenn, Wei, Lin-Gwei, Wang, Chi-Hsien, Cheng, Ya-Chen, Chang, Junn-Liang, Tsou, Tai-Li, Ku, Chih-Hung, Li, Chun-Chang, Chiu, Wen-Kuan, Chen, Chieh-Feng

Journal:

Annals of Plastic Surgery

Year:

2017

Language:

english

File:

PDF, 606 KB

english, 2017

37

500-Gray γ-Irradiation May Increase Adhesion Strength of Lyophilized Cadaveric Split-Thickness Skin Graft to Wound Bed

Wei, Lin-Gwei, Chen, Chieh-Feng, Wang, Chi-Hsien, Cheng, Ya-Chen, Li, Chun-Chang, Chiu, Wen-Kuan, Wang, Hsian-Jenn

Journal:

Annals of Plastic Surgery

Year:

2017

Language:

english

File:

PDF, 466 KB

english, 2017

38

The Impact of Oxide Traps Induced by SOI Thickness on Reliability of Fully Silicide Metal-Gate Strained SOI MOSFET

Cheng-Li Lin,, Yu-Ting Chen,, Fon-Shan Huang,, Wen-Kuan Yeh,, Chien-Ting Lin,

Journal:

IEEE Electron Device Letters

Year:

2010

Language:

english

File:

PDF, 435 KB

english, 2010

39

via the Reaction

Lin, Wen-Kuan, Scheibling, F., Kavanagh, R. W.

Journal:

Physical Review C

Year:

1970

Language:

english

File:

PDF, 703 KB

english, 1970

40

Effect of gate capping configurations and silicon-on-insulator thickness with external stresses on partially depleted metal-oxide-semiconductor field-effect transistors

Chang, Wen-Teng, Lin, Jian-An, Wang, Chih-Chung, Yeh, Wen-Kuan

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2011

Language:

english

File:

PDF, 874 KB

english, 2011

41

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - The high balance symmetric balun for WLAN and WiMAX application using the Integrated Passive Device (IPD) technology

Wu, Sung-Mao, Lin, Wang-Yu, Wang, Kao-Yi, Huang, Chien-Hsiang, Yeh, Wen-Kuan

Year:

2009

Language:

english

File:

PDF, 1.24 MB

english, 2009

42

Room-temperature Solution-Processed n-Doped Zirconium Oxide Cathode Buffer Layer for Efficient and Stable Organic and Hybrid Perovskite Solar Cells

Chang, Chih-Yu, Huang, Wen-Kuan, Wu, Jhao-Lin, Chang, Yu-Chia, Lee, Kuan-Ting, Chen, Chin-Ti

Journal:

Chemistry of Materials

Year:

2015

Language:

english

File:

PDF, 1.44 MB

english, 2015

43

Baseline circulating stem-like cells predict survival in patients with metastatic breast Cancer

Lee, Chun-Hui, Hsieh, Jason Chia-Hsun, Wu, Tyler Min-Hsien, Yeh, Ting-Shiuan, Wang, Hung-Ming, Lin, Yung-Chan, Chen, Jen-Shi, Lee, Chia-Lin, Huang, Wen-Kuan, Hung, Tsung-Min, Yen, Tzu-Tsen, Chan, Shen

Journal:

Year:

2019

Language:

english

File:

PDF, 1.09 MB

english, 2019

44

Significant improvement of 45 nm and beyond complementary metal oxide semiconductor field effect transistor performance with fully silicided and ultimate spacer process technology

Chia-Wei Hsu, Yean-Kuen Fang, Chien-Ting Lin, Wen-Kuan Yeh, Che-Hua Hsu, Chieh-Ming Lai, Li-Wei Cheng, Mike Ma

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 404 KB

english, 2008

45

[IEEE 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2016.8.3-2016.8.5)] 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Effects of fin width on performance and reliability for N- and P-type FinFETs

Yeh, Wen-Kuan, Zhang, Wenqi, Shih, Chia-Hung, Yang, Yi-Lin

Year:

2016

Language:

english

File:

PDF, 545 KB

english, 2016

46

[IEEE CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on Lasers and Electro-Optics (IEEE Cat. No.03TH8671) - Taipei, Taiwan (Dec. 15-19, 2003)] CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on Lasers and Electro-Optics (IEEE Cat. No.03TH8671) - Studies of silver nanoparticles in aqueous solution by surface plasmon resonance

Tzu-Chiang Chen,, Yao-Leng Lin,, Wen-Kuan Su,, Liann-Be Chang,

Year:

2003

Language:

english

File:

PDF, 69 KB

english, 2003

47

Microstructure and piezoelectric properties of reactively sputtered highly C-axis ScxAl1-xN thin films on diamond-like carbon/Si substrate

Liauh, Woan Jwu, Wu, Sean, Huang, Jow-Lay, Lii, Ding-Fwu, Lin, Zhi-Xun, Yeh, Wen-Kuan

Journal:

Surface and Coatings Technology

Year:

2016

Language:

english

File:

PDF, 3.57 MB

english, 2016

48

Angular Correlations from the Reaction

Lin, Wen-Kuan, Scheibling, F.

Journal:

Physical Review C

Year:

1971

Language:

english

File:

PDF, 825 KB

english, 1971

49

Effect of Ba-Co ferrite on bandwidth of monopole antenna

Lin, Wen-Kuan, Chen, Lih-Shan, Wang, Chia-Hung

Journal:

Microwave and Optical Technology Letters

Year:

2014

Language:

english

File:

PDF, 445 KB

english, 2014

50

The Improvement of Reliability of High-k/Metal Gate pMOSFET Device with Various PMA Conditions

Yang, Yi-Lin, Zhang, Wenqi, Cheng, Chi-Yun, Yeh, Wen-kuan

Journal:

Active and Passive Electronic Components

Year:

2012

Language:

english

File:

PDF, 432 KB

english, 2012

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